Features

● Unique heatsink design for better dissipation
● Low profile heatsink for effortless installation
● Supports the latest Intel X299 platform and implements 2666MHz
● Fast speeds up to 3600MHz
● Superior power efficiency: 20% less draw than DDR3 (operating voltage decreased from 1.5V to 1.2V)
● Intel XMP 2.0 – more accessible overclocking
● RoHS compliant

Specifications

● Speed: DDR4 2666MHz ~ 3600MHz
● Module size: 8GB ~ 32GB
*8GB: 8GBx1
*16GB: 8GBx2, 16GBx1
*32GB: 16GBx2, 32GBx1
*64GB: 32GBx2
● Compatibility: DDR4 2666 CL 19-19-19 at 1.2V
● Operating Temperature: 0°C to 85°C
● Storage temperature: -55°C to 100°C
● Operating Voltage: 1.2V~1.35V
● Dimensions (L x W x H): 133 x 36 x 7.5mm